Heat Insulation Silicone Pad, Silicone Solder Mat, S130 35x25cm BGA Soldering Repair Mat with Screw Location
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Repair PadS130 35x25cm Silicone Heat Insulation Pad: BGA Soldering Repair Mat with Screw Placement
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Features:
Brand new and high quality heat insulation pad.
Resistance to high temperature of 500 °C.
Several hole location to set screws, IC chips and small parts.
Built-in scale ruler (0 ~ 20 cm).
Screw location (200 small holes).
Make your repair work easy.
A good partner for hot air gun.
The pad may have dust or other appearance minor defect. It does not affect the function.
Please make sure that you don't care that. Thank you.
Specification:
Weight: approx 280 g
Size: 35 x 25 cm / 13.8 x 9.8 inch
Heat resistance: 500 °C
Material: Environmentally friendly organosilicone
Package Included:
1 x Heat Insulation pad (35 x 25 cm)