MECHANIC IC Glue Removal Station 160-250℃ Adjustable, No Air Gun or Soldering Iron Needed, for iPhone CPU and Samsung Chip Degluing

Designed for precision smartphone and CPU maintenance, this compact device simplifies intricate chip repairs. It features a smart one-button heating system that quickly reaches the optimal temperature, allowing for safe and effortless glue and tin removal. The built-in retractable clamping mechanism ensures your IC chips and CPUs are securely held in place during delicate procedures, preventing accidental slips or component damage.

Key Features:

• One-Button Rapid Heating: Instantly heats up to safely melt away stubborn adhesive and tin without damaging sensitive logic board components.

• Secure Retractable Clamping: Provides an adjustable, firm grip on various sizes of IC chips and CPUs for stable, precise work.

• Compact & Portable: The space-saving mini design fits perfectly on any workbench and is easy to store or carry.

• Versatile Maintenance: Ideal for BGA repair, CPU desoldering, and general IC chip cleaning.

Specifications:

• Product Type: IC Chip Glue & Tin Removal Station

• Model: Heat-Mini

• Working Size (heating): 21 x 18 mm

• Product Size: 79 x 71 x 21 mm

• Packing Size: 105 x 80 x 25 mm

• Net Weight: 77.5g

• Gross Weight: 110g

Package Includes:

• 1 x Mini IC Chip Glue Removal Station