5pcs Professional Heat Insulation Pad for BGA Desoldering & Precision Chip Repair

Protect delicate electronic components during high-temperature rework with this professional-grade heat insulation pad. Designed specifically for precision chip repair and BGA desoldering, this protective mat effectively blocks excess heat from hot air stations, preventing accidental thermal damage to surrounding motherboard parts and sensitive circuits.

Key Advantages:

• Exceptional Heat Resistance: Reliably withstands working temperatures up to 200°C during intensive soldering tasks.

• Premium Insulation: Crafted from high-quality glass wool to ensure superior heat deflection and safe handling.

• Versatile Application: The ideal workbench companion for smartphone motherboard repairs, microscopic IC chip rework, and general electronics maintenance.

Specifications:

• Material: Glass Wool

• Max Temperature Resistance: 200°C

• Weight: 13g

• Best For: BGA desoldering, precision chips, mobile device repair

• Size: 105 x 145mm

Package Contents:

• 1 x Heat Insulation Pad Pack(5pcs)